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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/14/1998
Application #:
08885196
Filing Dt:
06/30/1997
Inventors:
YASUHIRO HIRANO, MASATSUGU AKIBA, YUTAKA SHIOMI, NORIAKI SAITO
Title:
FILLER-CONTAINING RESIN COMPOSITION SUITABLE FOR INJECTION MOLDING AND TRANSFER MOLDING
Assignment: 1
Reel/Frame:
015583/0464Recorded: 01/12/2005Pages: 3
Conveyance:
CHANGE OF ASSIGNEE'S CORPORATE ADDRESS.
Assignor:
Exec Dt:
10/01/2004
Assignee:
27-1, SHINKAWA 2-CHOME, CHUO-KU
TOKYO, JAPAN
Correspondent:
PILLSBURY WINTHROP LLP
P.O. BOX 10500
1600 TYSONS BOULEVARD
MCLEAN, VA 22102
Assignment: 2
Reel/Frame:
021185/0698Recorded: 07/03/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/15/2005
Assignee:
7TH FLOOR, NO. 301, SONGKIANG ROAD
TAIPEI, TAIWAN, CHINA
Correspondent:
SAFIYA JARVIS
111 HUNTINGTON AVENUE
BOSTON, MA 02199

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