Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/21/1998
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Application #:
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08738095
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Filing Dt:
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10/25/1996
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Inventors:
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MICHIO OSADA, KEIJI MAEDA
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Title:
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RESIN SEALING AND MOLDING APPARATUS FOR SEALING ELECTRONIC PARTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 122-2, MEGAWA, MAKISHIMA-CHO, UJI-SHI |
| KYOTO, JAPAN |
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| W. G. FASSE |
| P.O. BOX K |
| INDIAN POND LANE |
| ST. ALBANS, ME 04971 |
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