Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/11/1998
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Application #:
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08564438
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Filing Dt:
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11/29/1995
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Inventor:
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HIROKI ITO
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Title:
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ULTRASONIC SINGLE-POINT BONDER FOR SEMICONDUCTOR DEVICE FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| HAYES, SOLOWAY, ET AL |
| NORMAN P. SOLOWAY |
| 175 CANAL STREET |
| MANCHESTER, NH 03101 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONMUMAMBE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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