Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/08/1998
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Application #:
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08811150
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Filing Dt:
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03/04/1997
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Inventors:
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MIN CHEOL AN, DO SOO JEONG
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Title:
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STACKED CHIP PACKAGE DEVICE EMPLOYING A PLURALITY OF LEAD ON CHIP TYPE SEMICONDUCTOR CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SUWON-CITY |
416, MAETAN-DONG, PALDAL-GU |
KYUNGKI-DO, KOREA, REPUBLIC OF |
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JONES & VOLENTINE, L.L.P. |
RAYMOND C. JONES |
12200 SUNRISE VALLEY DRIVE, SUITE 150 |
RESTON, VA 20191 |
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