Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
09/22/1998
|
Application #:
|
08807081
|
Filing Dt:
|
02/27/1997
|
Inventors:
|
KEIZO TANAKA, YOSHIKAZU YOMOGIHARA
|
Title:
|
THERMOCOMPRESSING BONDING METHOD AND THERMOCOMPRESSING BONDING APPARATUS
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
72, HORIKAWA-CHO, SAIWAI-KU |
KAWASAKI-SHI, JAPAN |
|
|
|
OBLON, SPIVAK, MCCLELLAND, MAIER |
& NEUSTADT, P.C., ATTORNEYS AT LAW |
MARVIN J. SPIVAK, FOURTH FLOOR |
1755 JEFFERSON DAVIS HIGHWAY |
ARLINGTON, VIRGINIA 22202 |
|
|
Search Results as of:
04/27/2024 07:48 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|