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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5831810
Issue Dt:
11/03/1998
Application #:
08701029
Filing Dt:
08/21/1996
Inventors:
KENNETH A. BIRD, PETER J. BROFMAN, FRANCIS F. CAPPO JR., JASON L. FRANKEL et al
Title:
ELECTRONIC COMPONENT PACKAGE WITH DECOUPLING CAPACITORS COMPLETELY WITHIN DIE RECEIVING CAVITY OF SUBSTRATE
Assignment: 1
Reel/Frame:
008155/0304Recorded: 08/21/1996Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BIRD, KENNETH A.
Exec Dt:
07/26/1996
BROFMAN, PETER J.
Exec Dt:
08/02/1996
CAPPO, FRANCIS F. JR.
Exec Dt:
08/08/1996
FRANKEL, JASON L.
Exec Dt:
07/30/1996
KADAKIA, SURESH D.
Exec Dt:
08/15/1996
KNICKERBOCKER, SARAH HUFFSMITH
Exec Dt:
07/26/1996
SIKORSKI, SCOTT A.
Exec Dt:
07/26/1996
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
AZIZ M. AHEAN
DEPT. 18G/BLDG. 300-482
1580 ROUTE 52
HOPEWELL JUNCTION, NY 12533-6531

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