Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/10/1998
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Application #:
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08802868
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Filing Dt:
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02/19/1997
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Inventors:
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TERUO NAKANISHI, AKIRA MAEDA, MIKIO WATANABE, TOSHIKAZU KAWAHATA, TOSHIHIRO KURITA et al
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Title:
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COPPER ALLOY FOR ELECTRONIC PARTS, LEAD-FRAME, SEMICONDUCTOR DEVICE AND CONNECTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO 100, JAPAN |
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| 1 FUKUDA-CHO, JOETSU-SHI |
| NIGATA 942, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER ET AL. |
| NORMAN F. OBLON |
| FOURTH FLOOR |
| 1755 JEFFERSON DAVIS HIGHWAY |
| ARLINGTON, VIRGINIA 22202 |
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