Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08695006
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Filing Dt:
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08/09/1996
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Inventors:
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HUN-JAN TAO, CHIA-SHIUNG TSAI
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Title:
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WAFER SURFACE MODIFICATION FOR IMPROVED ELECTROSTATIC CHUCKING EFFICIENCY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE BASED INDUSTRIAL PARK |
| NO. 121 PARK AVENUE 3 |
| HSIN-CHU, TAIWAN, CHINA |
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| BARNES, KISSELLE, RAISCH, CHOATE, |
| WHITTEMORE & HULBERT, P.C. |
| RANDY W. TUNG |
| 645 GRISWOLD, 3500 PENEBSCOT BUILDING |
| DETROIT, MI 48226-4217 |
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