Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/24/1998
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Application #:
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08816504
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Filing Dt:
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03/13/1997
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Inventor:
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KUN-TANG TENG
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Title:
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APPARATUS FOR PLACING AND ALIGNING SOLDER BALLS ONTO SOLDER PADS ON A SUBSTRATE FOR MANUFACTURING IC DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SEC. 4, CHUNG-HSING |
| CHUTUNG, HSINCHU, TAIWAN ROC |
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| FINNEGAN, HENDERSON, ET AL. |
| ATTN: YITAI HU |
| SUITE 700 |
| 1300 I STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F, NO. 86, FU SHING N. ROAD |
| TAIPEI, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE, SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041 |
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