Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/24/1998
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Application #:
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08601046
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Filing Dt:
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02/23/1996
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Inventors:
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KOUTA NODA, TOORU INOUE, BENZHEN YUAN
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Title:
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HIGH DENSITY MULTI-LAYERED PRINTED WIRING BOARD, MULTI-CHIP CARRIER AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, KANDA-MACHI 2-CHOME, OGAKI-SHI |
| GIFU-KEN 503, JAPAN |
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| HICKMAN BEYER & WEAVER |
| STEVE D. BEYER |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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