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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/08/1998
Application #:
08740530
Filing Dt:
10/30/1996
Inventors:
TOSHI SASAKI, TERUYUKI WATAHIKI, HIROKI TANAKA, TAKAHARU YONEMOTO, TAKASHI SUZUMURA
Title:
METHOD OF APPLYING ADHESIVE TO LEAD OF LEAD FRAME AND METHOD OF MAKING SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
008319/0362Recorded: 01/10/1997Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/09/1997
Exec Dt:
01/09/1997
Exec Dt:
01/09/1997
Exec Dt:
01/09/1997
Exec Dt:
01/09/1997
Assignee:
1-2, MARUNOUCHI 2-CHOME, CHIYDA-KU
TOKYO, JAPAN
Correspondent:
LOWE, PRICE, LEBLANC & BECKER
STEPHEN A. BECKER
99 CANAL CENTER PLAZA
SUITE 300
ALEXANDRIA, VA 22314

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