Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/08/1998
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Application #:
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08747169
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Filing Dt:
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11/08/1996
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Inventors:
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PAUL J FISCHER, ROBIN E. GORRELL, MARK F. SYLVESTER
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Title:
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DIMENSIONALLY STABLE CORE FOR USE IN HIGH DENSITY CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 555 PAPER MILL ROAD, P.O. BOX 9329 |
| NEWARK, DELAWARE 19714 |
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| W.L. GORE & ASSOCIATES, INC. |
| VICTOR M. GENCO, JR. |
| 551 PAPER MILL ROAD |
| P.O. BOX 9206 |
| NEWARK, DE 19714 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 9206 |
| 551 PAPER MILL ROAD |
| NEWARK, DELAWARE 19714 |
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| W.L. GORE & ASSOCIATES, INC. |
| DARLENE S. MCGRATH |
| 551 PAPER MILL ROAD |
| P.O. BOX 9206 |
| NEWARK, DELAWARE 19714 |
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