Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/15/1998
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Application #:
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08824780
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Filing Dt:
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03/26/1997
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Inventors:
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KIYOHARU MIYAKAWA, OSAMU MORIKAWA
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Title:
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METHOD OF STICKING SEMICONDUCTOR WAFER AND ITS STICKING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2612, SHINOMIYA, HIRATSUKA-SHI |
KANAGAWA, JAPAN |
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VARNDELL LEGAL GROUP |
R. EUGENE VARNDELL, JR. |
SUITE 220 |
1150 S. WASHINGTON ST. |
ALEXANDRIA, VA 22314 |
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