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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
01/19/1999
Application #:
08710356
Filing Dt:
09/17/1996
Inventor:
DAVID C. MCCLURE
Title:
INTEGRATED-CIRCUIT DIE SUITABLE FOR WAFER-LEVEL TESTING AND METHOD FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
008237/0052Recorded: 11/13/1996Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/18/1996
Assignee:
M/S 2346
1310 ELECTRONICS DRIVE
CARROLTON, TEXAS 75006
Correspondent:
LISA K. JORGENSON
M/S 2346
1310 ELECTRONICS DRIVE
CARROLLTON, TX 75006-5039
Assignment: 2
Reel/Frame:
009483/0420Recorded: 09/28/1998Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/19/1998
Assignee:
M/S 2346
1310 ELECTRONICS DRIVE
CARROLLTON, TEXAS 75006
Correspondent:
LISA K. JORGENSON
M/S 2346
1310 ELECTRONICS DRIVE
CARROLLTON, TX 75006
Assignment: 3
Reel/Frame:
032722/0553Recorded: 04/21/2014Pages: 54
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/30/2010
Assignee:
21557 TELEGRAPH ROAD
SOUTHFIELD, MICHIGAN 48033
Correspondent:
BROOKS KUSHMAN P.C.
1000 TOWN CENTER
22ND FLOOR
SOUTHFIELD, MI 48075

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