Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/26/1999
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Application #:
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08691678
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Filing Dt:
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08/02/1996
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Inventor:
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CHENG-LIEN CHIANG
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Title:
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METHOD OF PACKAGING SEMICONDUCTOR CHIPS BASED ON LEAD-ON-CHIP(LOC) ARCHITECTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC 4, CHUNG HSING RD. |
| HSINCHU 310, TAIWAN R.O.C |
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| BACON & THOMAS |
| EUGENE MAR, ESQUIRE |
| 625 SLATERS LANE |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F, NO. 86, FU SHING N. ROAD |
| TAIPEI, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE, SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041 |
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