Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/1999
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Application #:
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08565269
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Filing Dt:
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11/30/1995
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Inventors:
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ROBERT J WOJNAROWSKI, THOMAS B GORCZYCA, STANTON E WEAVER JR
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Title:
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HIGH DENSITY INTERCONNECTED CIRCUIT MODULE WITH A COMPLIANT LAYER AS PART OF A STRESS-REDUCING MOLDED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| LOCKHEED MARTIN CORPORATION |
| GEOFFREY H. KRAUSS |
| BLDG. 8, ROOM 10B50 |
| P.O. BOX 8555 |
| PHILADELPHIA, PA 19101 |
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