Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/1999
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Application #:
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08831599
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Filing Dt:
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04/10/1997
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Inventors:
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HAJIME HIROFUMI, TOSHIHARU YUBITANI
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Title:
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METHOD FOR POLISHING THE TOP AND BOTTOM OF A SEMICONDUCTOR WAFER SIMULTANEOUSLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2612, SHINOMIYA, HIRATSUKA-SHI |
| KANAGAWA, JAPAN |
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| R. EUGENE VARNDELL, JR. |
| VARNDELL LEGAL GROUP |
| SUITE 220, 1150 S. WASHINGTON ST. |
| ALEXANDRIA, VA 22314 |
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