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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	5876273	Issue Dt:	03/02/1999	Application #:	08625291	Filing Dt:	04/01/1996
Inventors:	HIROYUKI YANO, KATSUYA OKUMURA, NORIO KIMURA, TOMOYUKI YAHIRO, HOZUMI YASUDA
Title:	APPARATUS FOR POLISHING A WAFER

Assignment: 1

Reel/Frame:

Recorded: 09/27/1996

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

Exec Dt:

09/03/1996

Exec Dt:

09/04/1996

Exec Dt:

09/10/1996

Exec Dt:

09/10/1996

Exec Dt:

09/10/1996

Assignees:

72 HORIKAWA-CHO, SAIWAI-KU

KAWASAKI-SHI, JAPAN

11-1, HANEDA ASAHICHO, OHTA-KU

TOKYO, JAPAN

Correspondent:

BANNER & WITCOFF, LTD.

JOSEPH M. POTONZA

ELEVENTH FLOOR

1001 G STREET, N.W.

WASHINGTON, D.C. 20001-4597

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