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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/02/1999
Application #:
08739662
Filing Dt:
10/31/1996
Inventors:
OSAMU NAKAYAMA, KOJI ISHIKAWA
Title:
METALLIC ELECTRONIC COMPONENT PACKAGING ARRANGEMENT
Assignment: 1
Reel/Frame:
008297/0417Recorded: 10/31/1996Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/23/1996
Exec Dt:
10/23/1996
Assignee:
10 FUKUURA 3-CHOME, KANAZAWA-KU, YOKOHAMA-SHI
KANAGAWA-KEN, JAPAN
Correspondent:
SKJERVEN, MORRILL, MACPHERSON ET AL
ALAN H. MACPHERSON, ESQ.
25 METRO DRIVE, SUITE 700
SAN JOSE, CA 95110

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