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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/02/1999
Application #:
08803655
Filing Dt:
02/21/1997
Inventors:
CHENG P. WEN, KUO-HSIN LI, WAH S. WONG
Title:
FLIP CHIP MICROWAVE MODULE AND FABRICATION METHOD
Assignment: 1
Reel/Frame:
008525/0016Recorded: 02/20/1997Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/18/1997
Exec Dt:
02/18/1997
Exec Dt:
02/18/1997
Assignee:
7200 HUGHES TERRACE, BLDG. CO1, M/S A126
LOS ANGELES, CALIFORNIA 90045
Correspondent:
HUGHES ELECTRONICS
MARY E. LACHMAN
7200 HUGHES TERRACE
BLDG CO1, M/S A126
LOS ANGELES, CALIFORNIA 90045

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