Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/1999
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Application #:
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09105055
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Filing Dt:
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06/26/1998
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Inventors:
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KYUNG W PALK, SE YOUNG JANG
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Title:
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METHOD FOR FABRICATING CHIP SIZE PACKAGES USING LAMINATION PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 373-1 KUSUNG-DONG |
| YOOSUNG-GU, TAEJEON, KOREA, REPUBLIC OF |
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| HICKMAN & MARTINE, LLP |
| PAUL L. HICKMAN |
| P.O. BOX 52037 |
| PALO ALTO, CA 94303-0746 |
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