Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08911674
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Filing Dt:
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08/15/1997
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Inventors:
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KENZO HANAWA, TAKAYUKI ARAKI, YOSHINOBU OKAMURA, YASUHIRO ASANO
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Title:
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SOLDER POWDER, METHOD FOR MAKING THE SOLDER POWDER AND SOLDER PASTE USING THE SOLDER POWDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1-1, NIHONBASHI-MUROMACHI, CHUO-KU |
| TOKYO 103, JAPAN |
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| FLYNN, THIEL, BOUTELL & TANIS, P.C. |
| TERRYENCE F. CHAPMAN |
| 2026 RAMBLING ROAD |
| KALAMAZOO, MI 49008-1699 |
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