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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/23/1999
Application #:
08605542
Filing Dt:
02/14/1996
Inventors:
YASUNAO KAI, AKIRA MISHIMA, SHINJI GOTOH, CHIAKI YAMASAKI
Title:
SUBSTRATE AND HEAT SINK FOR A SEMICONDUCTOR AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
007995/0127Recorded: 05/16/1996Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/27/1996
Exec Dt:
02/27/1996
Exec Dt:
02/27/1996
Exec Dt:
02/27/1996
Assignee:
2-8, MINOSHIMA 1-CHOME, HAKATA-KU, FUKUOKA-SHI
FUKUOKA-KEN, JAPAN
Correspondent:
KECK, HAHIN & CATE
ROBERT J. SCHNEIDER
P.O. BOX 06110
CHICAGO, IL 60606-0110

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