Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08727973
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Filing Dt:
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10/09/1996
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Inventors:
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NOBORU SHINGAI, TATSUO WADA, KATSURO AOSHIMA
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Title:
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CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BUMP-TYPE CONTACT HEAD AND SEMICONDUCTOR COMPONENT PACKAGING MODULE USING THE CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, OGAMI 5-CHOME, AYASE-SHI |
| KANAGAWA, JAPAN |
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| 15-15-105, DAITA 3-CHOME, SETAGAWA-KU |
| TOKYO, JAPAN |
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| FRISHAUF, HOLTZ, GOODMAN, LANGER & CHICK |
| ATTN: LEONARD HOLTZ |
| 767 THIRD AVENUE |
| 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 5668-1, FUKUDA, YAMATO-SHI |
| KANAGAWA, JAPAN |
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| FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C. |
| LEONARD HOLTZ |
| 767 THIRD AVENUE, 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-15, OGAMI 5-CHOME, |
| AYASE-SHI, KANAGAWA, JAPAN |
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| LEONARD HOLTZ |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001-7708 |
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