Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08864969
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Filing Dt:
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05/29/1997
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Inventor:
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TOSHIHIRO HANAMURA
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Title:
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CHIP COMPOSITE ELECTRONIC COMPONENT WITH IMPROVED MOISTURE RESISTANCE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU |
| KYOTO-SHI, JAPAN |
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| NIKAIDO, MARMELSTEIN, ET.AL. |
| DAVID T. NIKAIDO |
| METRO. SQUARE, 655 15TH ST., N.W. |
| SUITE 330, G STREET LOBBY |
| WASHINGTON, D.C. 20005-5701 |
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