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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/04/1999
Application #:
08705155
Filing Dt:
08/29/1996
Inventors:
FUMITAKA KAI, MASAHIKO MAEDA, JUN-ICHI YAMASHITA, TOSHIHARU YUBITANI, HIROFUMI HAJIME et al
Title:
METHOD FOR FABRICATING SEMICONDUCTOR WAFERS
Assignment: 1
Reel/Frame:
008372/0959Recorded: 02/28/1997Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/19/1996
Exec Dt:
09/19/1996
Exec Dt:
09/19/1996
Exec Dt:
09/19/1996
Exec Dt:
09/19/1996
Exec Dt:
09/19/1996
Assignee:
2612, SHINOMIYA, HIRATSUKA-SHI
KANAGAWA, JAPAN
Correspondent:
VARNDELL LEGAL GROUP
R. EUGENE VARNDELL, JR.
SUITE 220
1150 S. WASHINGTON ST.
ALEXANDRIA, VA 22314

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