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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/04/1999
Application #:
08859863
Filing Dt:
05/21/1997
Inventors:
CHIA SHIUNG TSAI, HUN-JAN TAO
Title:
METHOD FOR ANCHORING VIA/CONTACT IN SEMICONDUCTOR DEVICES AND DEVICES FORMED
Assignment: 1
Reel/Frame:
008573/0106Recorded: 05/21/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/07/1997
Exec Dt:
05/07/1997
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
NO. 121, PARK AVENUE, 3
HSIN-CHU, TAIWAN
Correspondent:
BARNES, KISSELLE, RAISCH, CHOATE,
WHITTEMORE & HULBERT, P.C.
RANDY W. TUNG
3500 PENOBSCOT BLDG., 645 GRISWOLD ST.
DETROIT, MI 48226

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