Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/04/1999
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Application #:
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08914610
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Filing Dt:
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08/21/1997
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Inventor:
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RYUJI IMAI
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Title:
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WIRED BASE PLATE AND PACKAGE FOR ELECTRONIC PARTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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14-18, TAKATSUJI-CHO, MIZUHO-KU, AICHI |
NAGOYA-SHI, JAPAN 467 |
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FOLEY & LARDENR |
RICHARD L. SCHWAAB |
300 K STREET, N.W., SUITE 500 |
WASHINGTON, D.C. 20007-5109 |
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