Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08785699
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Filing Dt:
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01/17/1997
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Inventor:
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HIEP DIEP-QUANG
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Title:
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EPOXY BASED, VOC-FREE SOLDERING FLUX
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 109 CORPORATE BOULEVARD |
| SOUTH PLAINFIELD, NEW JERSEY 07080 |
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| LATHAM & WATKINS LLP |
| 355 SOUTH GRAND AVENUE |
| LOS ANGELES, CA 90071-1560 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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| 745 SEVENTH AVENUE |
| NEW YORK, NEW YORK 10019 |
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| LATHAM & WATKINS LLP |
| 355 SOUTH GRAND AVENUE |
| LOS ANGELES, CA 90071-1560 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 300 ATRIUM DRIVE |
| 3RD FLOOR |
| SOMERSET, NEW JERSEY 08873 |
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| LATHAM & WATKINS LLP C/O ANGELA M. AMARU |
| 885 THIRD AVENUE |
| NEW YORK, NY 10022 |
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