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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
5914861
Issue Dt:
06/22/1999
Application #:
08996356
Filing Dt:
12/22/1997
Inventors:
DIETRICH RICHTER, PETER STRAUB, MARIAN LANCKI, PETER DIEHM, DIETER BERCHTOLD et al
Title:
CIRCUIT-BOARD OVERLAID WITH A COPPER MATERIAL ON BOTH SIDES OR IN MULTIPLE LAYERS AND A METHOD OF FABRICATING SAME
Assignment: 1
Reel/Frame:
009523/0702Recorded: 10/16/1998Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
RICHTER, DIETRICH
Exec Dt:
09/21/1998
STRAUB, PETER
Exec Dt:
08/03/1998
LANCKI, MARIAN
Exec Dt:
09/10/1998
DIEHM, PETER
Exec Dt:
08/03/1998
BERCHTOLD, DIETER
Exec Dt:
08/28/1998
WISSMEIER, HANS-GEORG
Exec Dt:
09/11/1998
Assignees:
SIEMENS AG
POSTFACH 22 16 34
D-80506 MUNCHEN, GERMANY
PPC ELECTRONIC AG
RIEDSTRASSE 2
CH-6330 CHAM, SWITZERLAND
Correspondent:
KENYON & KENYON
RICHARD L. MAYER
ONE BROADWAY
NEW YORK, NY 10004
Assignment: 2
Reel/Frame:
014734/0316Recorded: 09/22/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SIEMENS AKTIENGESELLSCHAFT
Exec Dt:
02/04/2003
Assignee:
PPC ELECTRONIC AG
RIEDSTRASSSE 2
CH-6330 CHAM, SWITZERLAND
Correspondent:
KENYON & KENYON
RICHARD L. MAYER
ONE BROADWAY
NEW YORK, NY 10004

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