Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/1999
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Application #:
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08802988
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Filing Dt:
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02/21/1997
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Inventors:
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AKIHIRO TAMBA, KAZUJI YAMADA, RUICHI SAITO, TATSUYA SHIGEMURA, YUKIO SONOBE et al
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Title:
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POWER SEMICONDUCTOR MODULE EMPLOYING METAL BASED MOLDED CASE AND SCREW FASTENING TYPE TERMINALS FOR HIGG RELIABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHIYODA-KU |
| 6, KANDA SURUGADAI 4-CHOME |
| TOKYO, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| GREGORY E. MONTONE |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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