Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/20/1999
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Application #:
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08582744
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Filing Dt:
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01/04/1996
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Inventor:
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THIAM B. LIM
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Title:
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LOW COST AND HIGHLY RELIABLE CHIP-SIZED PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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11 SCIENCE PARK ROAD, SCIENCE PARK II |
SIGNAPORE, SINGAPORE 11768 |
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MELTZER, LIPPE, GOLDSTEIN, |
WOLF AND SCHLISSEL, P.C. |
ANTHONY C. COLES |
190 WILLIS AVENUE |
MINEOLA, NEW YORK 11501 |
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