Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/10/1999
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Application #:
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08872655
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Filing Dt:
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06/10/1997
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Inventors:
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CHIARN-LUNG LEE, WEI-KUN YEH, SHYH-JEN GUO
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Title:
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VIA STRUCTURE USING A COMPOSITE DIELECTRIC LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 9, CREATION RD. 1 |
HSINCHU, TAIWAN R.O.C |
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CHRISTENSEN O'CONNOR JOHNSON & KINDNESS |
CHUN M. NG, ESQ. |
1420 FIFTH AVENUE, SUITE 2800 |
SEATTLE, WA 98101-2347 |
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