Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/1999
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Application #:
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08639506
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Filing Dt:
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04/29/1996
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Inventors:
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YASUHIRO HIRANO, MASATSUGU AKIBA, AKIRA YOKOTA, HIROSHI NAKAMURA, SHIGEKI NAITOH
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Title:
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EPOXY RESIN, RESIN COMPOSITION, AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA-4-CHOME, CHUO-KU |
| OSAKA, JAPAN |
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| CUSHMAN DARBY & CUSHMAN, L.L.P. |
| KENDREW H. COLTON |
| 1100 NEW YORK AVENUE, N.W. |
| NINTH FLOOR, EAST TOWER |
| WASHINGTON, D.C. 20005-3918 |
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