Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/17/1999
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Application #:
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08919242
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Filing Dt:
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08/28/1997
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Inventors:
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NORIAKI HIGUCHI, TAKAAKI FUKUMOTO, TOSHIO SHIOBARA, EIICHI ASANO, KAZUTOSHI TOMIYOSHI
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Title:
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EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE ENCAPSULATED THEREWITH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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| 6-1, OHTEMACHI 2-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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| MILLEN, WHITE, ZELANO, ET AL. |
| JOAN K. KLEIN |
| ARLINGTON COURTHOUSE PLAZA 1, SUITE 1400 |
| 2200 CLARENDON BOULEVARD |
| ARLINGTON, VA 22201 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OTEMACHI 2-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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| MILLEN WHITE ZELANO & BRANIGAN, P.C. |
| JOHN A. SOPP |
| 2200 CLARENDON BOULEVARD, SUITE 1400 |
| ARLINGTON, VIRGINIA 22201 |
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