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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/31/1999
Application #:
08947884
Filing Dt:
10/09/1997
Inventors:
YAT MENG NG, XIN ZHANG
Title:
ELIMINATION OF VOID FORMATION IN ALUMINUM BASED INTERCONNECT STRUCTURES
Assignment: 1
Reel/Frame:
008780/0839Recorded: 10/09/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/02/1997
Exec Dt:
10/02/1997
Assignee:
60 WOODLANDS INDUSTRIAL PARK D STREET 2
SINGAPORE 738406, SINGAPORE
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603

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