Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/28/1999
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Application #:
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08865542
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Filing Dt:
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05/29/1997
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Inventors:
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HARUHIKO FURUKAWA, YOSHITSUGU MORITA, TOSHIO SARUYAMA, MAKOTO YOSHITAKE
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Title:
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THERMOSETTING RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4TH FLOOR, A1G BUILDING, 1-1-3, MARUNOUCHI |
| CHIYODA-KU, TOKYO 100, JAPAN |
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| DOW CORNING CORPORATION |
| ARNE R. JARNHOLM |
| PATENT DEPT. - MAIL CO1232 |
| P.O. BOX 994 |
| MIDLAND, MI 48686-0994 |
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