Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/05/1999
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Application #:
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09042236
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Filing Dt:
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03/13/1998
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Inventors:
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WEN-HAO LIANG, CHIN-JONG CHAN, HSIU-HSIN CHUNG, RUEYWAY LIN
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Title:
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BONDING PAD STRUCTURE FOR INTEGRATED CIRCUIT (III)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 4, CREATION RD. III |
| HSINCHU, TAIWAN R.O.C |
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| FISH & RICHARDSON P.C. |
| ERIC L. PRAHL |
| 225 FRANKLIN STREET |
| BOSTON, MASSACHUSETTS 02110-2804 |
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