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Patent Assignment Abstract of Title
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Total Assignments: 6
Patent #:
5963815
Issue Dt:
10/05/1999
Application #:
09009966
Filing Dt:
01/21/1998
Inventors:
YOSHIHIKO OKAMOTO, TADASHI YOSHIDA, HIROSHI OHNISHI, KENICHI HANAOKA, SHIGEKI NAKAJIMA et al
Title:
METHOD FOR FORMING A SURFACE -ROUGHENED CONDUCTIVE FILM ON A SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
008935/0878Recorded: 01/21/1998Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OKAMOTO, YOSHIHIKO
Exec Dt:
01/06/1998
YOSHIDA, TADASHI
Exec Dt:
01/06/1998
OHNISHI, HIROSHI
Exec Dt:
01/12/1998
HANAOKA, KENICHI
Exec Dt:
01/12/1998
NAKAJIMA, SHIGEKI
Exec Dt:
01/13/1998
TSUCHIMOTO, JUNICHI
Exec Dt:
01/06/1998
Assignees:
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3 MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO 100, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
1, MIZUHARA 4-CHOME, ITAMA-SHI
HYOGO 664, JAPAN
Correspondent:
LOWE PRICE LEBLANC & BECKER
STEPHEN A. BECKER
99 CANAL CENTER PLAZA, SUITE 300
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
043583/0156Recorded: 09/13/2017Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
Exec Dt:
04/01/2003
Assignee:
RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
1-3, MIZUHARA 4-CHOME, ITAMI-SHI
HYOGO, JAPAN
Correspondent:
LYNN CRUZ
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001
Assignment: 3
Reel/Frame:
025980/0219Recorded: 03/18/2011Pages: 67
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MITSUBISHI DENKI KABUSHIKI KAISHA
Exec Dt:
03/07/2011
Assignee:
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI,
KANAGAWA, JAPAN 211-8668
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 THIRTEENTH STREET, N.W.
WASHINGTON, DC 20005-3096
Assignment: 4
Reel/Frame:
042692/0192Recorded: 06/13/2017Pages: 15
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
Exec Dt:
04/01/2014
Assignee:
RENESAS NAKA SEMICONDUCTOR CORPORATION
730, HORIGUCHI
HITACHINAKA-SHI, IBARAKI, JAPAN
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001
Assignment: 5
Reel/Frame:
043902/0816Recorded: 09/19/2017Pages: 25
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
RENESAS NAKA SEMICONDUCTOR CORPORATION
Exec Dt:
04/01/2014
Assignee:
RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
751, HORIGUCHI, HITACHINAKA-SHI
IBARAKI, JAPAN
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001
Assignment: 6
Reel/Frame:
044928/0001Recorded: 11/29/2017Pages: 235
Conveyance:
CHANGE OF ADDRESS
Assignor:
RENESAS ELECTRONICS CORPORATION
Exec Dt:
08/06/2015
Assignee:
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU
TOKYO, JAPAN
Correspondent:
MATTINGLY & MALUR, PC
1800 DIAGONAL ROAD
SUITE 210
ALEXANDRIA, VA 22314

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