Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/12/1999
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Application #:
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08884778
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Filing Dt:
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06/30/1997
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Inventor:
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KENICHI NAKAMURA
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Title:
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BIODEGRADABLE MOLDING MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22-33, HIRAISANSO |
TAKARAZUKA-SHI, HYOGO, JAPAN |
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KODA AND ANDROLIA |
WILLIAM L. ANDROLIA |
10100 SANTA MONICA BLVD. |
SUITE 2340 |
LOS ANGELES, CA 90067 |
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