Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/19/1999
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Application #:
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08826441
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Filing Dt:
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03/24/1997
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Inventors:
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SHOICHI TAKAMIZAWA, NORIHIRO KOBAYASHI
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Title:
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SILICON WAFER INCLUDING AMORPHOUS SILICON LAYER FORMED BY PCVD AND METHOD OF MANUFACTURING WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHIYODA-KU |
| 4-2, MARUNOUCHI 1-CHOME, |
| TOKYO, JAPAN |
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| OLIFF & BERRIDGE |
| WILLIAM P. BERRIDGE |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| OLIFF & BERRIDGE |
| WILLIAM P. BERRIDGE |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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