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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
5976912
Issue Dt:
11/02/1999
Application #:
08716362
Filing Dt:
09/18/1996
Inventors:
NAOKI FUKUTOMI, YOSHIAKI TSUBOMATSU, FUMIO INOUE, TOSHIO YAMAZAKI, HIROHITO OHHATA et al
Title:
FABRICATION PROCESS OF SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
008264/0707Recorded: 09/18/1996Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FUKUTOMI, NAOKI
Exec Dt:
08/12/1996
TSUBOMATSU, YOSHIAKI
Exec Dt:
08/12/1996
INOUE, FUMIO
Exec Dt:
08/12/1996
YAMASAKI, TOSHIO
Exec Dt:
08/12/1996
OHHATA, HIROHITO
Exec Dt:
08/12/1996
HAGIWARA, SHINSUKE
Exec Dt:
08/12/1996
TAGUCHI, NORIYUKI
Exec Dt:
08/12/1996
NOMURA, HIROSHI
Exec Dt:
08/12/1996
Assignee:
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO 163-04, JAPAN
Correspondent:
PENNIE & EDMONDS
CHARLES E. MILLER
1155 AVENUE OF THE AMERICAS
NEW YORK, NY 10036

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