Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08980201
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Filing Dt:
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11/28/1997
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Inventor:
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SEIICHI SATO
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Title:
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CHIP COMPRESSION-BONDING APPARATUS AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN |
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| WATSON COLE STEVENS DAVIS, P.L.L.C. |
| JAMES E. LEDBETTER |
| SUITE 1000/JEL 30433 |
| 1400 K STREET, N.W. |
| WASHINGTON, DC 20005-2477 |
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