Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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09218656
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Filing Dt:
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12/22/1998
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Inventors:
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KO-YU HSIAO, KUEN-FENG CHEN, KAI-HUNG HUANG
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Title:
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COMPACT ASSEMBLY CONFIGURATION AND PROCESS FOR REDUCING LEAD WIRE CONNECTIONS AND SOLDER JOINTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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144 MIN-CHUAN E. RD. SEC. 3 |
9TH FLOOR, ASIA ENTERPRISE CENTER |
TAIPEI 10464, TAIWAN R.O.C |
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BO-IN LIN |
13445 MANDOLI DRIVE |
LOS ALTOS HILLS, CA 94022 |
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