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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/23/1999
Application #:
07424402
Filing Dt:
10/20/1989
Inventors:
TATSUKI MATSUO, TOSHIAKI HOKUDOH, KUNIHARU MORI, YOSHINOBU TAKAHASHI, TAKERU TOIDA et al
Title:
MOLDING MATERIAL FOR THERMOPLASTIC COMPOSITES
Assignment: 1
Reel/Frame:
005204/0550Recorded: 12/19/1989Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST.
Assignors:
Exec Dt:
12/11/1989
Exec Dt:
12/11/1989
Exec Dt:
12/11/1989
Exec Dt:
12/11/1989
Exec Dt:
12/11/1989
Exec Dt:
12/11/1989
Assignee:
2-8, DOJIMAHAMA 2-CHOME, KITA-KU, OSAKA-SHI,
OSAKA-FU, JAPAN
Correspondent:
LEYDIG, VOIT & MAYER
ONE IBM PLAZA, STE 4600
CHICAGO, IL 60611

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