Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/23/1999
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Application #:
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07424402
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Filing Dt:
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10/20/1989
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Inventors:
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TATSUKI MATSUO, TOSHIAKI HOKUDOH, KUNIHARU MORI, YOSHINOBU TAKAHASHI, TAKERU TOIDA et al
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Title:
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MOLDING MATERIAL FOR THERMOPLASTIC COMPOSITES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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2-8, DOJIMAHAMA 2-CHOME, KITA-KU, OSAKA-SHI, |
OSAKA-FU, JAPAN |
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LEYDIG, VOIT & MAYER |
ONE IBM PLAZA, STE 4600 |
CHICAGO, IL 60611 |
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