Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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09083444
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Filing Dt:
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05/22/1998
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Inventors:
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CHIH-KUNG HUANG, WEI-JEN LAI
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Title:
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LEADFRAME FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, SHIH CHIEN ROAD, HU KOU, HSINCHU INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C |
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| FINNEGAN, HENDERSON, FARABOW, ET AL |
| DAVID W. HILL |
| 1300 I STREET, N.W. |
| WASHINGTON, DC 20005-3315 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1FL., NO. 172, SEC. 2, NANJING E. RD. |
| JUNGSHAN CHIU, TAIPEI 104, TAIWAN R.O.C. |
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| J. C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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