Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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08875484
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Filing Dt:
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07/29/1997
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Inventors:
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MASAYUKI SASAKI, TAKAYOSHI HANABUSE
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Title:
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SEMICONDUCTOR PACKAGE WITH MULTILAYER CIRCUIT, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN, OASA KURITA, NAGANO-SHI |
| NAGANO, JAPAN |
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| PENNIE & EDMONDS LLP |
| ALLAN A. FANUCCI |
| 1667 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL 8826, FRAME 0726.
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| 711, AZA SHARIDEN, OAZA KURITA |
| NAGANO-SHI, NAGANO, JAPAN |
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| PENNIE & EDMONDS LLP |
| ALLAN A. FANUCCI |
| 1667 K STREET, NW |
| WASHINGTON, DC 20006 |
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