Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08940685
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Filing Dt:
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09/30/1997
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Inventors:
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ROBERT W. BATZ JR., KENNETH C. HAUGAN, HARRY J. GEYER, ROBERT W. BERNER
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Title:
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METHODS FOR PLATING SEMICONDUCTOR WORKPIECES USING A WORKPIECE-ENGAGING ELECTRODE ASSEMBLY WITH SEALING BOOT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P. O. BOX 7010 |
| KALISPELL, MONTANA 59904 |
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| WELL, ST. JOHNS, ROBERTS, ET AL. |
| RANDY A. GREGORY |
| 601 W. FIRST AVENUE, STE. 1300 |
| SPOKANE, WA 99201-3817 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON & SHERIDAN, L.L.P. |
| 3040 POST OAK BLVD., SUITE 1500 |
| HOUSTON, TX 77056-6582 |
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