Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08551917
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Filing Dt:
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10/23/1995
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Inventors:
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ETSUO YAMADA, YASUSHI SHIRAISHI, HIROSHI KAWANO, SHINJI OHUCHI, HIDEKAZU NASU
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Title:
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STRUCTURE OF RESIN MOLDED TYPE SEMICONDUCTOR DEVICE WITH EMBEDDED THERMAL DISSIPATOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MINATO-KU |
| 7-12, TORANOMON 1-CHOME |
| TOKYO, JAPAN |
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| FRISHAUF, HOLTZ, GOODMAN, ET AL. |
| THOMAS LANGER |
| 767 THIRD AVENUE |
| 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 550-1 HIGASHIASAKAWA-CHO |
| HACHIOJI-SHI, TOKYO, JAPAN 193-8550 |
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| KUBOTERA & ASSOCIATES, LLC |
| 200 DAINGERFIELD ROAD, SUITE 202 |
| ALEXANDRIA, VA 22314 |
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