Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/21/1999
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Application #:
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09008550
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Filing Dt:
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01/16/1998
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Inventors:
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MITSUO TOGAWA, KAZUHIKO MIYABAYASHI, TAKAHIRO HORIE, NAOKI NARA
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Title:
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EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN MOLDED TYPE SEMICONDUCTOR DEVICE SEALED WITH THE EPOXY RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHISHIJUKU 2-CHOME SHINJUKU-KU |
| TOKYO 163-04, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| WILLIAM I. SOLOMON |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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